Mar 25
2008UBS: 3G Infineon Chipset in Next-Generation iPhone in mid-2008
Filed Under (General) by rajesh on 25-03-2008
Eureka!!! Eureka!!! The Next Generation iPhone is on the way with 3G Infineon
Chipset according a note from UBS global equity research analyst Nicolas Gaudois,Apple has tapped German Chip Manufacturer Infineon to produce Chip for next Generation 3G iphone.The chipset includes a digital baseband Controller,Power Management Unit(PMU),will finally bring a 3G HSDPA-enabled iPhone to Market-bringing faster data speeds to the web-surfing iPhone masses
More encouraging than the confirmation that Infineon will be providing the 3G hardware for the 3G iPhone is the expectation that the next-generation of iPhone could be upon us quite soon. Gaudois said that, “Consistent with these checks, our Apple analyst Ben Reitzes believes that 3G iPhones will be released by mid-year.” That belief is in line with CNBC’s Jim Goldman’s report that we’ll have a 3G iPhone in-hand by late May or early June 2008.
Moreover Gaudois mentioned that Infineon is slowing down the Production of the EDGE baseband hardware and slowly to stop the Production,which is all because of 3G iPhone’s entry into the HSPDA landscape
This indeed is a great news. I have seen some snaps of flip type iphone too .. leaked at itunes … it will another great addition to iphone
@kanak
ah, fliptype iPhone. but how will apple still keep the big screen and touch facility in the flip phone. lets wait and see.